Authors

ABSTRACT SUBMISSION IS CLOSED 

EIC 2020 TECHNICAL CHAIRS AND A SELECTED GROUP OF SPECIALISTS ARE REVIEWING THE ABSTRACTS

NOTIFICATION OF ABSTRACT APPROVAL / REJECTION IS NOVEMBER 30th.

EIC CALL FOR PAPERS 2020

The 38th Electrical Insulation Conference (EIC) will be held in Knoxville, TN, USA, 7 to 11 June 2020 at the Knoxville Convention Center.  The conference program features technical sessions with oral presentations in concurrently running tracks, poster sessions and short courses.  We are soliciting papers dealing with application, development, analysis, testing, and service experience with electrical insulation in electrical and electronic equipment around the following themes:

  • NEW** Failure Analysis
  • Rotating Machines
  • Transformers
  • Cables and accessories
  • Testing Technologies
  • Outdoor Insulation
  • Nanodielectrics
  • Partial Discharge
  • Switchgear (including arrestors)
  • Bushings
  • Capacitors
  • New materials
  • Transportation Systems

Important Dates

Abstract submission opens
Abstract submission deadline ** EXTENDED
Notification of abstract acceptance
Registration opens
Manuscript submission for peer review
Author registration and full payment required
Final submission of reviewed/revised manuscripts		 23 August 2019
CLOSED
30 November 2019
15 January 2020
31 January 2020
21 February 2020
31 March 2020

Abstract Submission

Abstracts of up to 500 words are invited on the practical applications of electrical insulating systems and materials. All submissions will be done on-line starting 23 August 2019. For further information or to submit abstracts, please go to the ConfTool abstract submission website 

IEEE copyright form is required for all submitted papers. Authors must pay their registration fee in full for their papers to be published in the Conference Proceedings. Papers must be presented at the Conference in order to be considered for placement on IEEE Xplore. Requests from authors for “Letters of Invitation” may only be made after payment of the registration fee.

For any questions regarding the abstracts and paper submissions please contact the Technical Program Chairs:

Joe Williams e-mail: joe.w@electrolock.com
Alan Sbravati e-mail: alan_sbravati@cargill.com

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